Method for manufacturing rigid-flexible printed circuit board
US8591692B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 11, 2011 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Dec 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.