Sputtering system and method for depositing thin film
US8591706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Sep 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/266
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sputtering system for depositing a thin film on the surface of a disc substrate in which high precision positioning of an inner mask and an outer mask is facilitated. The sputtering system has a mask member placed on the surface of the substrate mounted on a substrate holder to cover a partial region on the surface of the substrate. A thin film is deposited by sputtering in a region on the surface of the substrate not covered by the mask member. A section for carrying in and carrying out the substrate has mechanically holds and releases the substrate holder mounting the substrate, and mechanically holds and releases the mask member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.