Molded shoe rands
US8591784B1 · kind B1 · utility
1Cited by
3References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 18, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Dec 14, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D35/126
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A variable-thickness climbing shoe rand may be fabricated by digitally scanning a variable-thickness rand prototype, transmitting scan data to a computer numerically controlled mold fabrication device, creating a rand mold with the mold fabrication device, cutting a slab of uncured high-friction rubber to fit within the mold, and curing the slab within the mold to create a variable-thickness climbing shoe rand, which may then be bonded to a climbing shoe upper and finished with little or no grinding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.