Debondable adhesive article
US8592034B2 · kind B2 · utility
23Cited by
28References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Sep 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2813
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adhesive article is described that is debondable from substrates or adherends with the application of heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.