Electronic device module comprising polyolefin copolymer
US8592679B2 · kind B2 · utility
5Cited by
40References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2012 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Nov 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic device module comprising: Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.