Omnibus logic element for packing or fracturing
US8593174B1 · kind B1 · utility
3Cited by
79References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Jun 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/017581
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Disclosed is a logic element (LE) that can provide a number of advantageous features. For example, the LE can be configured to implement register packing and/or a fracturable look up table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.