Scanner performance comparison and matching using design and defect data
US8594823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Oct 19, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7065
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.