Thermal management of a mobile device with ventless housing
US8595517B2 · kind B2 · utility
8Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | May 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A mobile device includes a housing having a plurality of surfaces. A processor is located within the housing. The processor heats a portion of one or more of the surfaces of the housing. A temperature sensor detects a temperature of the portion of the surface. The rate of energy consumption by the processor is adjusted based on the temperature of the portion of the surface of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.