Low overhead dynamic thermal management in many-core cluster architecture
US8595731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Sep 28, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/5094
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.