Separable liquid-cooling heat-dissipation module
US8596338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2011 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A separable liquid-cooling heat-dissipation module has a first flow pipe, a second flow pipe, and a plurality of heat conduction blocks. The second flow pipe is set on a top end of the first flow pipe. A bottom end of the second flow pipe has a gap, so that a heat-insulating structure is formed between the first flow pipe and the second flow pipe. The heat conduction blocks are installed on both sides of the first flow pipe and the second flow pipe. A combination of the first flow pipe, the second flow pipe, and the heat conduction blocks provides a modular heat-dissipation structure and also achieves effects of heat-dissipation and energy-saving.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.