Floor through-passage molding apparatus
US8596605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Nov 26, 2030 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04G15/06
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention provides a floor through-passage molding apparatus adapted for a floor construction, which comprises a forming sleeve, a first covering plate assembly, a second covering plate assembly and a plurality of retaining assemblies. Said forming sleeve has a sleeve wall defining a hollow channel, a first opening and a second opening. Said first and second covering plate assemblies are respectively disposed on the first and second openings of said forming sleeve. Said plurality of retaining assemblies passes through the hollow channel of said forming sleeve, and are respectively retained with the first and second covering plate assemblies by a plurality of corresponding retaining holes formed on said first and second covering plate assemblies, wherein positions of the plurality of corresponding retaining holes distributed on said first covering plate assembly or said second covering plate assembly jointly define at least one plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.