Multi-die LED package and backlight unit using the same
US8596816B2 · kind B2 · utility
7Cited by
7References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Oct 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B45/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-die LED package comprises a diode that works as a light-emitting diode for emitting light and as a sensing diode for detecting at least one physical quantity. The multi-die LED package is able to provide desired luminance and color independent of aging, temperature or other effects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.