Manufacture of light emitting devices with phosphor wavelength conversion
US8597963B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Aug 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A method of manufacturing a light emitting device: an LED wafer having an array of LEDs formed on a surface thereof, the method comprises: a) fabricating a sheet of phosphor/polymer material comprising a light transmissive polymer material having at least one phosphor material distributed throughout its volume and in which the polymer material is transmissive to light generated by the LEDs and to light generated by the at least one phosphor material; b) selectively making apertures through the phosphor/polymer sheet at positions corresponding to electrode contact pads of the LEDs of the LED wafer; c) attaching the sheet of phosphor/polymer material to the surface of the LED wafer such that each aperture overlies a respective electrode contact pad; and d) dividing the wafer into individual light emitting devices. The method can further comprise, prior to dividing the LED wafer, cutting slots through the phosphor/polymer material that are configured to pass between individual LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.