Manufacturing method of LED package structure
US8597964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2012 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Apr 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.