Light-emitting device and electronic device using the light-emitting device
US8597965B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2012 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | May 9, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.