Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
US8598490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2011 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Oct 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0057
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.