Electronic device with an insulating layer including a groove and a protrusion, and method of manufacturing the same

US8598572B2 · kind B2 · utility

Assignee

• SAMSUNG ELECTRONICS CO., LTD. · KR

Inventors

• Arthur Mathea · Berlin, DE
• Joerg Fischer · Laboe, DE
• Marcus Schaedig · Königs Wusterhausen, DE

Key dates

• Filing date: Jul 5, 2011
• Grant date: Dec 3, 2013
• Expiry date: Jan 30, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/13

Abstract

Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.