Patent · US Active

Composite substrate for a semiconductor chip

US8598705B2 · kind B2 · utility

1Cited by

5References

18Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Jürgen Moosburger · Regensburg, DE
Peter Stauß · Nittendorf, DE
Andreas Plößl · Regensburg, DE

Key dates

Filing date	Nov 9, 2009
Grant date	Dec 3, 2013
Priority date	—
Expiry date	Dec 1, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31678
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A composite substrate for a semiconductor chip includes a first covering layer containing a semiconductor material, a second covering layer, and a core layer arranged between the first covering layer and the second covering layer, wherein the core layer has a greater coefficient of thermal expansion than the covering layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.