Waveguide transition for connecting U-shaped surface mounted waveguide parts through a dielectric carrier
US8598961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2008 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Apr 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts and a dielectric carrier material with a metallization and a ground plane provided on a respective first main side and second main side Surface-mountable waveguide parts comprise a first wall, a second wall, and a third wall, which second and third walls are arranged to contact a part of the metallization, all the walls together essentially forming a U-shape, the surface-mountable waveguide parts also comprising respective bend parts. The metallization on the first main side is removed such that a first aperture and a second aperture are formed, the apertures being enclosed by a frame of via holes electrically connecting the ground plane with the metallization, the bend parts being fitted such that the apertures permit passage of a microwave signal propagating via the bend parts. Then the dielectric carrier material itself acts as a waveguide transition between the first aperture and the second aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.