Printed circuit board
US8599566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a printed circuit board having an insulating support layer and a layer of conductive material applied thereto. In order to increase the flexibility of the printed circuit board, it is proposed that material from the support layer have been removed at at least one point on the printed circuit board on a side of the support layer which is opposite the layer of conductive material in order to form a straight groove which extends from one side of the printed circuit board to another side of the printed circuit board, so that the printed circuit board can be bent along the groove, wherein the material of the support layer which has remained in the region of the groove and/or the layer of conductive material in the region of the groove form(s) a bending edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.