Patent · US Active

Printed circuit board

US8599566B2 · kind B2 · utility

1Cited by
1References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 16, 2010
Grant dateDec 3, 2013
Priority date
Expiry dateMar 25, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/302
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a printed circuit board having an insulating support layer and a layer of conductive material applied thereto. In order to increase the flexibility of the printed circuit board, it is proposed that material from the support layer have been removed at at least one point on the printed circuit board on a side of the support layer which is opposite the layer of conductive material in order to form a straight groove which extends from one side of the printed circuit board to another side of the printed circuit board, so that the printed circuit board can be bent along the groove, wherein the material of the support layer which has remained in the region of the groove and/or the layer of conductive material in the region of the groove form(s) a bending edge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.