Wafer aligning apparatus and related method
US8600150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Jan 25, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.