Apparatus and method for controlling temperature of semiconductor wafers
US8600543B2 · kind B2 · utility
5Cited by
1References
10Claims
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Key dates
| Filing date | Nov 9, 2009 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Jul 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When a temperature of a semiconductor wafer is controlled to be a target temperature by raising the temperature of the semiconductor wafer, switching is performed so that a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank is supplied into an inside-stage flow channel, and respective thermoelectric elements in a plurality of zones in a stage are controlled; and then, the temperature of the semiconductor wafer matches the target temperature and a desired in-plane temperature distribution of the semiconductor wafer is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.