Patent · US Active

System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device

US8601428B2 · kind B2 · utility

5Cited by

4References

36Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

James D. Burrell · San Diego, US
Zhongping Bao · San Diego, US
Liang Cheng · Beijing, CN
Damion B. Gastelum · San Diego, US
Gary D. Good · Burleson, US
Mohammed Tantoush · Austin, US
Jon James Anderson · Boulder, US

Key dates

Filing date	Jun 29, 2012
Grant date	Dec 3, 2013
Priority date	—
Expiry date	Jun 29, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG06F2119/08
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Various embodiments of methods and systems for heuristic determination and thermal analysis of component placement on a printed circuit board (“PCB”) for use in a portable computing device (“PCD”) are disclosed. It is an advantage of embodiments that thermal energy generating components, such as processors, may be heuristically selected and arranged on a selected PCB according to varying layouts and combinations and then evaluated for thermal dissipation efficiency under an assortment of use case scenarios. In this way, users of the system and method may quickly narrow down commercially feasible component layouts, identify the most efficient layouts and then heuristically modify the layouts to develop an optimal arrangement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.