Device cover and method for fabricating the same
US8601849B2 · kind B2 · utility
8Cited by
8References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 21, 2009 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Sep 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12382
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device cover includes a bottom base and at least one sidewall extending from the bottom base. The at least one sidewall is formed by an upsetting process. The device cover is made of metal. Only one fold is formed by flow tracks of metallic grain of the at least one sidewall. A method for fabricating the device cover is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.