Housing-integrated optical semiconductor component and manufacturing method thereof
US8602661B2 · kind B2 · utility
1Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2008 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2283/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a manufacturing method of a housing-integrated optical semiconductor component, an optical device (26, 27) is packaged on a lead frame (24, 25) having a leg portion (28), and a periphery of the optical device (26, 27) is sealed by an optically transmissive material, whereby an optical semiconductor component (22) is manufactured. Thereafter, a housing (23) is integrally molded to the optical semiconductor component (22) so that the housing (23) covers a portion (30) of the optical semiconductor component, which is sealed by the optically transmissive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.