Wire set having a sheath bonded to a polyvinylchloride overmolding using polyurethane
US8602820B2 · kind B2 · utility
3Cited by
21References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2011 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.