Polyamide resin compositions
US8603600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 4, 2011 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Jul 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31739
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
[Problems]Provided is a polyamide resin material having high elastic modulus, good gas barrier properties, low water absorption and excellent flexibility.[Means for solving the problems]This is a polyamide resin composition comprising a polyamide resin (A) composed of a diamine structural unit and a dicarboxylic acid structural unit wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid, and 1 to 40 parts by mass of at least one copolyamide (B) selected from the following group consisting of (B-1)-(B-3) per 100 parts by mass of the polyamide resin (A);(B-1): a copolyamide 6/66/12;(B-2): a copolyamide 6/66/11;(B-3): a polyether-polyamide copolymer composed of a polyamide 12 unit or a polyamide 11 unit and a polyether unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.