Radiation-sensitive resin composition, polymer and compound
US8603726B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Dec 13, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/303
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation-sensitive resin composition including (A) a polymer that includes a repeating unit (a1) and a fluorine atom, and (B) a photoacid generator, the repeating unit (a1) including a group shown by any of the following formulas (1-1) to (1-3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.