Three-dimensional MEMS structure and method of manufacturing the same
US8603848B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2010 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0015
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.