Polyamide moulding compound for producing moulded articles with a soft-touch surface and also corresponding moulded articles
US8604120B2 · kind B2 · utility
22Cited by
61References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Feb 28, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a polyamide moulding compound for producing moulded articles with a soft-touch surface, the polyamide moulding compound comprising a blend of an amine-terminated, amorphous polyamide and styrene-ethylene/butylene-styrene copolymer and also styrene-ethylene/butylene-styrene copolymer grafted with maleic anhydride. The invention relates furthermore to moulded articles which are produced with this moulding compound and the use thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.