Electronic device housing and manufacturing method thereof
US8605413B2 · kind B2 · utility
3Cited by
0References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2010 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Aug 26, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electronic device housing includes a bottom housing, a support plate, a display panel, and a side frame. The support frame is welded in the bottom housing. The display panel is positioned on the support plate. The side frame is connected to a top edge of the bottom housing, such that the display panel is sandwiched between the support plate and the side frame. A manufacturing method for an electronic device housing is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.