Structure comprising a getter layer and an adjusting sublayer and fabrication process
US8605445B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Nov 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.