Opto-electronic modules including electrically conductive connections for integration with an electronic device
US8606057B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2012 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Nov 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.