Micromechanical sensor
US8607632B2 · kind B2 · utility
2Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | May 2, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0235
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical sensor having at least one movably mounted measuring element which is opposite at least one stationary electrode, the electrode being situated in a first plane, and being contacted by at least one printed conductor track which is situated in a second plane. A third plane is located between the first plane and the second plane, the third plane including an electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.