In-liquid plasma film-forming apparatus, electrode for in-liquid plasma, and film-forming method using in-liquid plasma
US8607732B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 2, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Jun 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32357
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an in-liquid plasma film-forming apparatus having: a vessel 1 being capable of accommodating a substrate “S” and a liquid “L” including raw material therein; an electrode 2 for in-liquid plasma, electrode 2 which is disposed in the vessel 1; an electric power device 3 for supplying electricity to the electrode 2 for in-liquid plasma; the electrode 2 for in-liquid plasma is equipped with: a main electrode 21 having a discharging end 22; an auxiliary electrode 26 not only facing the discharging end 22 but also being disposed between the discharging end 22 and the substrate “S” that face each other; and a plasma generating unit 29 having a space that is demarcated by a surface 22a of the discharging end 22 and a surface 26a of the auxiliary electrode 26 facing the surface 22a, and being for generating plasma by means of electricity being supplied to the main electrode 21.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.