Patent · US Active

Radiation-sensitive resin composition and resist film formed using the same

US8609319B2 · kind B2 · utility

4Cited by

4References

17Claims

0Family size

Assignee

JSR CORPORATION · JP

Inventors

Toru Kimura · Tokyo, JP
Hiromitsu Nakashima · Tokyo, JP
Reiko Kimura · Tokyo, JP
Kazuki Kasahara · Tokyo, JP
Masafumi Hori · Tokyo, JP
Masafumi Yoshida · Tokyo, JP

Key dates

Filing date	Sep 23, 2011
Grant date	Dec 17, 2013
Priority date	—
Expiry date	Dec 20, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/0397
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A radiation-sensitive resin composition that includes (A) a polymer that includes a repeating unit (a1) and a fluorine atom, the repeating unit (a1) including a group shown by the following formula (1) or (2), the radiation-sensitive resin composition including the polymer (A) in an amount of 0.1 mass % or more and less than 20 mass % based on the total amount of polymers included in the radiation-sensitive resin composition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.