Vapor deposition method, vapor deposition device and organic EL display device
US8609442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2011 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/164
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating film (90) is formed by causing vapor deposition particles (91) discharged from a vapor deposition source opening (61) of a vapor deposition source (60) to pass through a space between a plurality of control plates (81) of a control plate unit (80) and a mask opening (71) of a vapor deposition mask in this order and adhere to a substrate, while the substrate (10) is moved relative to the vapor deposition mask (70) in a state in which the substrate (10) and the vapor deposition mask (70) are spaced apart at a fixed interval. A difference in the amount of thermal expansion between the vapor deposition source and the control plate unit is detected and corrected. It is thereby possible to form, at a desired position on a large-sized substrate, the coating film in which edge blur and variations in the edge blur are suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.