Method for laser singulation of chip scale packages on glass substrates
US8609512B2 · kind B2 · utility
3Cited by
41References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.