Modified polyamide composition containing at least one phenolic compound
US8609785B2 · kind B2 · utility
0Cited by
1References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 18, 2010 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Oct 18, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.