Input device securing techniques

US8610015B2 · kind B2 · utility

Assignee

• Microsoft Corporation · US

Inventors

• David Otto Whitt, III · Sammamish, US
• Timothy C. Shaw · Sammamish, US
• Rob Huala · Bellevue, US
• David C. Vandervoort · Seattle, US
• Matthew David Mickelson · Seattle, US
• Christopher Harry Stoumbos · Sammamish, US
• Joel Lawrence Pelley · Bellevue, US
• Todd David Pleake · Sammamish, US
• Hua Wang · Sammamish, US

Key dates

• Filing date: Oct 12, 2012
• Grant date: Dec 17, 2013
• Expiry date: Oct 12, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49826
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.