Thermally optimised LED chip-on-board module
US8610136B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Feb 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A LED Chip-on-Board (COB) module comprises a plurality of LED die arranged on a substrate in one or more radially concentric rings about a center point such that each LED die is azimuthally offset from neighboring LED die. The module includes thermal conduction pads each having lateral dimensions at least as large as the combined lateral dimensions of the LED die attached to it and a total surface area at least five times larger than the total surface area of all the LED die attached to it. At the same time, the total light emission area of the module is no greater than four times larger than the combined total surface emission area of all the individual LED die disposed on the substrate. A variety of configurations are possible subject to these criteria, which permit good packing density for enhanced brightness while ensuring optimal heat transfer. A method of manufacturing the module is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.