Localized heating for flip chip bonding
US8611050B1 · kind B1 · utility
37Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2013 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | May 7, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention relate to integral heating elements in solder pads for flip chip bonding. The integral heating elements are used to solder components together without exposing other locations and components in the assembly to potentially damaging temperatures. Embodiments of the invention may be used in manufacture of magnetic heads for EAMR hard disks to bond a laser sub-mount to an air-bearing slider without exposing magnetic head components to high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.