Patent · US Active

Solder alloys for repairing a component

US8613885B2 · kind B2 · utility

0Cited by

9References

7Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Paul Heinz · Forchheim, DE
Robert Singer · Erlangen, DE

Key dates

Filing date	Feb 26, 2008
Grant date	Dec 24, 2013
Priority date	—
Expiry date	Dec 11, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/001
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y′ phase and has improved mechanical properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.