Semiconductor devices and methods of manufacturing the same
US8614433B2 · kind B2 · utility
24Cited by
0References
23Claims
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Key dates
| Filing date | May 3, 2012 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | May 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/884
Abstract
A memory device includes a lower interconnection in a semiconductor substrate, the lower interconnection being made of a material different from the semiconductor substrate, a selection element on the lower interconnection, and a memory element on the selection element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.