Ruggedized waveguide encapsulation fixture for receiving a compressed waveguide component

US8614610B2 · kind B2 · utility

Assignee

• TELEDYNE SCIENTIFIC & IMAGING, LLC · US

Inventors

• Jonathan B. Hacker · Thousand Oaks, US
• Chris Hillman · Mörbylånga, SE
• Mark Field · Rancho Santa Fe, US
• Robert L. Borwick, III · Thousand Oaks, US

Key dates

• Filing date: Sep 7, 2010
• Grant date: Dec 24, 2013
• Expiry date: Oct 24, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P11/002
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A waveguide component encapsulation device may include a housing having first and second surfaces, the housing defining a channel extending through the first and second surfaces, a micromachined waveguide component configured to be positioned in the channel, the waveguide component having first and second ends extending outside the channel and beyond the first and second surfaces of the housing by a finite length, and a pair of spacing members configured to align and stabilize the waveguide component within the channel.