Photonics chip with efficient optical alignment and bonding and optical apparatus including the same
US8615149B2 · kind B2 · utility
2Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2011 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | Feb 26, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.