Bond surface testing apparatus and method
US8616050B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Apr 26, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bond surface testing apparatus includes a solution chamber; a plurality of solutions in the solution chamber, the solution chamber adapted to dispense the solutions onto a bonding surface; an information capture module carried by the solution chamber and adapted to capture information relating to bonding surface properties of the bonding surface; at least one analysis module interfacing with the information capture module and adapted to analyze the bonding surface properties of the bonding surface; and a structural wettability factor prediction module interfacing with the at least one analysis module and adapted to predict a structural wettability factor based on the bonding surface properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.