Patent · US Active

Pressure sensor assembly

US8616067B2 · kind B2 · utility

3Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 30, 2011
Grant dateDec 31, 2013
Priority date—
Expiry dateJun 20, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01L19/146
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A pressure sensor assembly is disclosed wherein the substrate to which the pressure sensing die is mounted is decoupled from the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.