Heat sink
US8616267B2 · kind B2 · utility
3Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2007 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jun 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.