Partitioned array ejection chips for micro-fluid applications
US8616680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2010 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/155
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged adjacently along corresponding ones of fluid vias skewed variously or not to enable seamless stitching of printed images from the adjacent firing elements. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Bond pads and overlying encapsulation materials are still other features as are metallization lines for distributing power to ones of firing elements. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.